7.What is Different Types of IC packaging ?

 IC are packaged in many types they are: * BGA1* BGA2* Ball grid array* CPGA* Ceramic ball grid array* Cerquad* DIP-8* Die attachment* Dual Flat No Lead* Dual in-line package* Flat pack * Flip chip* Flip-chip pin grid array* HVQFN* LQFP* Land grid array* Leadless chip carrier * Low insertion force* Micro FCBGA* Micro Leadframe Package* MicroLeadFrame* Mini-Cartridge* Multi-Chip Module* OPGA* PQFP* Package on package* Pin grid array* Plastic leaded chip carrier * QFN* QFP* Quadruple in-line package* ROM cartridge* Shrink Small-Outline Package* Single in-line package* Small-Outline Integrated Circuit* Staggered Pin Grid Array* Surface-mount technology* TO220* TO3* TO92* TQFP* TSSOP

* Thin small-outline package* Through-hole technology* UICC* Zig-zag in-line package